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LT3518 View Datasheet(PDF) - Analog Devices

Part Name
Description
MFG CO.
LT3518 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Package Description
Please refer to http://www.linear.com/product/LT3518#packaging for the most recent package drawings.
UF Package
16-Lead PlaUsFtiPc aQcFkNag(4emm × 4mm)
1(R6e-LfeereandcePLlTaCstDicWQGF#N05(4-0m8-m16×924RmevmØ))
(Reference LTC DWG # 05-08-1692 Rev Ø)
0.72 ±0.05
LT3518
4.35 ±0.05
2.15 ±0.05
2.90 ±0.05 (4 SIDES)
PACKAGE OUTLINE
0.30 ±0.05
0.65 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ±0.05
2.15 ±0.10
(4-SIDES)
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
0.55 ±0.20
1
2
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UF16) QFN 10-04
0.30 ±0.05
0.65 BSC
For more information www.linear.com/LT3518
3518ff
17

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