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EN5312QI View Datasheet(PDF) - Enpirion, Inc.

Part Name
Description
MFG CO.
EN5312QI Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
March 2007
EN5312QI
Thermal Pad.
Connect to
Ground plane
Figure 8. Exposed metal and mechanical dimensions of the package. Gray area represents bottom metal no-
connect and area that should be clear of any traces, planes, or vias, on the top layer of the PCB.
0.25
0.25
0.20
0.20
0.20
JEDEC minimum separation = 0.20
Figure 9. Exposed pad clearances; the Enpirion lead frame package complies with JEDEC requirements.
©Enpirion 2007 all rights reserved, E&OE
12
www.enpirion.com

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