March 2007
EN5312QI
Thermal Pad.
Connect to
Ground plane
Figure 8. Exposed metal and mechanical dimensions of the package. Gray area represents bottom metal no-
connect and area that should be clear of any traces, planes, or vias, on the top layer of the PCB.
0.25
0.25
0.20
0.20
0.20
JEDEC minimum separation = 0.20
Figure 9. Exposed pad clearances; the Enpirion lead frame package complies with JEDEC requirements.
©Enpirion 2007 all rights reserved, E&OE
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