VNQ810
THERMAL DATA (Per island)
Symbol
Rthj-lead
Rthj-amb
Rthj-amb
Parameter
Thermal Resistance Junction-lead per chip
Thermal resistance Junction-ambient (one chip ON)
Thermal resistance Junction-ambient (two chips ON)
60 (1)
46 (1)
Value
20
44 (2)
31 (2)
(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
(2) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
Unit
°C/W
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40°C< Tj <150°C, unless otherwise specified)
POWER OUTPUTS (Per each channel)
Symbol
VCC (**)
VUSD (**)
VOV (**)
RON
Parameter
Test Conditions
Operating Supply Voltage
Undervoltage Shut-down
Overvoltage Shut-down
On State Resistance
IOUT=1A; Tj=25°C
IOUT=1A; VCC>8V
IS (**) Supply Current
Off State; VCC=13V; VIN=VOUT=0V
Off State; VCC=13V; VIN=VOUT=0V;
Tj =25°C
On State; VCC=13V; VIN=5V; IOUT=0A
IL(off1)
IL(off2)
IL(off3)
IL(off4)
Off State Output Current
Off State Output Current
Off State Output Current
Off State Output Current
VIN=VOUT=0V
VIN=0V; VOUT=3.5V
VIN=VOUT=0V; VCC=13V; Tj =125°C
VIN=VOUT=0V; VCC=13V; Tj =25°C
Min Typ Max Unit
5.5
13
36
V
3
4
5.5
V
36
V
160
mΩ
320
mΩ
12
40
µA
12
25
µA
5
7
mA
0
50
µA
-75
0
µA
5
µA
3
µA
(**) Per island
SWITCHING (Per each Channel) (VCC=13V)
Symbol
Parameter
Test Conditions
Min Typ Max
td(on)
td(off)
Turn-on Delay Time
Turn-off Delay Time
dVOUT/dt(on) Turn-on Voltage Slope
RL=13Ω from VIN rising edge to
VOUT=1.3V
RL=13Ω from VIN falling edge to
VOUT=11.7V
RL=13Ω from VOUT=1.3V to VOUT=10.4V
30
30
See
relative
diagram
dVOUT/dt(off) Turn-off Voltage Slope RL=13Ω from VOUT=11.7V to VOUT=1.3V
See
relative
diagram
Unit
µs
µs
V/µs
V/µs
VCC - OUTPUT DIODE
Symbol
Parameter
VF
Forward on Voltage
Test Conditions
-IOUT=0.5A; Tj=150°C
Min Typ Max Unit
0.6
V
4/21
1