CY7C1021DV33-10VXI View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
MFG CO.
CY7C1021DV33-10VXI Datasheet PDF : 13 Pages
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CY7C1021DV33
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65C to +150C
Ambient Temperature with
Power Applied............................................. –55C to +125C
Supply Voltage on VCC to Relative GND[4] .... –0.3V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[4] ......................................–0.3V to VCC+0.3V
DC Input Voltage[4]...................................–0.3V to VCC+0.3V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current...................................................... >200 mA
Operating Range
Range
Industrial
Automotive-A
Automotive-E
Ambient
Temperature
–40 C to +85 C
–40 C to +85 C
–40 C to +125 C
VCC
3.3V 0.3V
Speed
10 ns
10 ns
12 ns
DC Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
VIH
Input HIGH Voltage
VIL
Input LOW Voltage[4]
IIX
Input Leakage Current
GND < VI < VCC
IOZ
Output Leakage Current GND < VI < VCC, Output Disabled
ICC
VCC Operating
Supply Current
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
100 MHz
83 MHz
66 MHz
40 MHz
ISB1
Automatic CE Power-Down Max. VCC, CE > VIH
Current —TTL Inputs
VIN > VIH or VIN < VIL, f = fMAX
ISB2
Automatic CE Power-Down Max. VCC, CE > VCC – 0.3V,
Current —CMOS Inputs VIN > VCC – 0.3V or VIN < 0.3V, f = 0
–10 (Ind’l/Auto-A)
Min.
Max.
2.4
0.4
2.0 VCC + 0.3
0.3
0.8
1
+1
1
+1
60
55
45
30
10
3
–12 (Auto-E)
Unit
Min.
Max.
2.4
V
0.4
V
2.0
0.3
VCC + 0.3 V
0.8
V
5
+5
A
5
+5
A
-
mA
100 mA
90
mA
60
mA
50
mA
15
mA
Capacitance[5]
Parameter
CIN
COUT
Description
Input Capacitance
Output Capacitance
Thermal Resistance[5]
Parameter
JA
JC
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
TA = 25C, f = 1 MHz, VCC = 3.3V
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
Max.
Unit
8
pF
8
pF
SOJ TSOP II VFBGA Unit
59.52 53.91 36 C/W
36.75 21.24
9
C/W
Notes
4. VIL (min.) = –2.0V and VIH(max) = VCC + 1V for pulse durations of less than 5 ns.
5. Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05460 Rev. *F
Page 3 of 13
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