ADSP-21160MKB-80 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
ADSP-21160MKB-80 Datasheet PDF : 60 Pages
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OUTLINE DIMENSIONS
The ADSP-21160x processors are available in a
27 mm ؋ 27 mm, 400-ball PBGA lead-free package.
ADSP-21160M/ADSP-21160N
BALL A1
INDICATOR
27.20
27.00 SQ
26.80
TOP VIEW
2.49
2.32
2.15
24.13
BSC
SQ
1.27
BSC
BALL A1 PAD CORNER
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
DETAIL A
0.60
0.55
0.50
BOTTOM VIEW
1.19
1.17
1.15
SEATING
PLANE
0.90
0.75
0.60
BALL DIAMETER
DETAIL A
0.70
0.60
0.50
0.20 MAX
COPLANARITY
Figure 42. 400-Ball Plastic Grid Array (PBGA) (B-400) Compliant to JEDEC Standards MS-034-BAL-2 (Dimensions in Millimeters)
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Package
400-Ball Grid Array (PBGA)
Ball Attach Type
Solder Mask Defined (SMD)
Solder Mask Opening
0.63 mm diameter
Ball Pad Size
0.76 mm diameter
Rev. C | Page 57 of 60 | February 2013
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