T1050 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
T1050 Datasheet PDF : 12 Pages
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BTA10, BTB10, T1035, T1050
Characteristics (curves)
Figure 8. Relative variation of gate trigger current, holding
current and latching current versus junction temperature
(typical values)
Figure 9. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]
2.5
2.0
IGT
1.5
1.0
IH and IL
0.5
0.0
Tj (°C)
-40 -20
0
20 40 60 80 100 120 140
(dl/dt)c [(dV/dt)c / specified (dl/dt)c
2.0
1.8
C
1.6
B
1.4
1.2
1.0
0.8
0.6
0.4
0.1
(dV/dt)c (V/µs)
1 .0
10.0
BW/CW/T10xx
100.0
Figure 10. Relative variation of critical rate of decrease of Figure 11. D²PAK thermal resistance junction to ambient
main current versus junction temperature
versus copper surface under tab
(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C]
6
5
4
3
2
1
0
Tj(°C)
0
25
50
75
100
125
80 Rth(j-a) (°C/W)
70
60
D²PAK
Epoxy printed board FR4, copper thickness = 35 µm
50
40
30
20
10
0
0
SCu(cm²)
5
10
15
20
25
30
35
40
DS3165 - Rev 9
page 5/12
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