T1050-8G(2017) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
T1050-8G Datasheet PDF : 14 Pages
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Characteristics
Figure 7: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values)
BTA10, BTB10, T10xx
Figure 8: Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
Figure 9: Relative variation of critical rate of
decrease of main current versus junction
temperature
(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C]
6
5
4
3
2
1
Tj(°C)
0
0
25
50
75
100
125
Figure 10: D2PAK thermal resistance junction to
ambient versus copper surface under tab
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0
Epoxy printed board FR4, eCU= 35 µm
SCu(cm²)
5
10
15
20
25
30
35
40
6/14
DocID2937 Rev 7
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