ISL6420A View Datasheet(PDF) - Renesas Electronics
Part Name
Description
MFG CO.
ISL6420A Datasheet PDF : 21 Pages
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ISL6420A
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010M) B M
GAUGE
PLANE
123
-A- D
SEATING PLANE
A
L
0.25
0.010
h x 45°
-C-
e
A1
A2
C
B
0.10(0.004)
0.17(0.007M) C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Sec-
tion 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not
exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protru-
sions. Interlead flash and protrusions shall not exceed
0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a
visual index feature must be located within the cross-
hatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allow-
able dambar protrusion shall be 0.10mm (0.004 inch) total
in excess of “B” dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter di-
mensions are not necessarily exact.
M20.15
20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
SYM-
BOL
INCHES
MIN MAX
MILLIMETERS
MIN MAX NOTES
A
0.053 0.069 1.35
1.75
-
A1
0.004 0.010 0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008 0.012 0.20
0.30
9
C
0.007 0.010 0.18
0.25
-
D
0.337 0.344 8.56
8.74
3
E
0.150 0.157 3.81
3.98
4
e
0.025 BSC
0.635 BSC
-
H
0.228 0.244 5.80
6.19
-
h
0.0099 0.0196 0.26
0.49
5
L
0.016 0.050 0.41
1.27
6
N
20
20
7
0°
8°
0°
8°
-
Rev. 1 6/04
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modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
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FN9169 Rev 4.00
December 4, 2009
Page 21 of 21
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