Package Dimensions
unit : mm
[LC75832W]
SPQFP64 10x10 / SQFP64
CASE 131AK
ISSUE A
LC75832E, LC75832W
12.00.2
10.00.1
(1.25)
1 2 0.5
0.18
0.150.05
0.10
SOLDERING FOOTPRINT*
11.40
(Unit: mm)
0 to 10
0.10
GENERIC MARKING DIAGRAM*
XXXXXXXX
YDD
XXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
DD = Additional Traceability Data
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
*This information is generic. Please refer to
device data sheet for actual part marking.
0.50
0.28
NOTE: The measurements are not to guarantee but for reference only.
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6