HI-5700/883 View Datasheet(PDF) - Intersil
Part Name
Description
MFG CO.
HI-5700/883 Datasheet PDF : 8 Pages
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Die Characteristics
DIE DIMENSIONS:
154.3 x 173.2 x 19 ± 1mils
METALLIZATION:
Type: Si - Al
Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ± 1kÅ
DIE ATTACH:
Material: Gold Silicon Eutectic Alloy
Temperature: Ceramic DIP - 460oC (Max)
WORST CASE CURRENT DENSITY:
3.05 x 104 A/cm2
Metallization Mask Layout
HI-5700/883
HI-5700/883
4
D4 5
3
21
1/4R
6
VDD
7
VDD
7
GND
8
GND
8
3/4R
9
26
28
27
25 AGND
24 AGND
23 AVDD
22 1/2R
21 AVDD
20 AGND
D3 10
11
12
13
14
15
16
17
19
AGND
18
AVDD
Spec Number 512023
6-13
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