M48Z58-70MH1F View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
M48Z58-70MH1F Datasheet PDF : 24 Pages
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M48Z58, M48Z58Y
3
Maximum ratings
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Caution:
Caution:
Table 5. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TA
Ambient operating temperature
0 to 70
°C
SNAPHAT® top –40 to 85
°C
TSTG Storage temperature (VCC off, oscillator off) CAPHAT® DIP –40 to 85
°C
SOH28
–55 to 125 °C
TSLD(1)(2)
VIO
VCC
IO
PD
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
Output current
Power dissipation
260
°C
–0.3 to 7.0
V
–0.3 to 7.0
V
20
mA
1
W
1. For DIP package, soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds.
Furthermore, the devices shall not be exposed to IR reflow nor preheat cycles (as performed as part of
wave soldering). ST recommends the devices be hand-soldered or placed in sockets to avoid heat damage
to the batteries.
2. For SOH28 package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260 °C (the time above
255 °C must not exceed 30 seconds).
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT® sockets.
Doc ID 2559 Rev 11
13/24
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