HCS08MS View Datasheet(PDF) - Intersil

Part Name

Description

MFG CO.

HCS08MS

Radiation Hardened Quad 2-Input AND Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20 x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

B1 (2)

HCS08MS

HCS08MS

A1

VCC

B4

(1)

(14)

(13)

Y1 (3)

A2 (4)

B2 (5)

(6)

(7)

(8)

Y2

GND

Y3

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518746

8

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