HT7501 View Datasheet(PDF) - Holtek Semiconductor
Part Name
Description
MFG CO.
HT7501 Datasheet PDF : 7 Pages
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Pad Assignment
HT7501
Chip size: 121 × 124 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
X
–54.78
–54.78
–54.78
–54.78
–54.78
–54.78
–54.78
–54.78
–54.78
–54.78
–52.53
–44.46
–37.10
–29.88
–22.82
–5.31
5.40
13.64
Y
54.10
46.45
39.10
31.45
24.10
16.45
9.10
1.45
–5.91
–13.56
–56.53
–56.53
–56.53
–56.53
–56.53
–56.53
–56.53
–56.53
Pad No.
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
X
20.27
54.78
54.78
54.78
54.78
54.78
54.02
54.02
54.02
51.13
44.50
37.87
31.24
18.02
1.95
–17.34
–23.97
–40.97
Unit: mil
Y
–56.53
–56.53
–49.30
–37.99
–25.58
–1.02
8.50
15.13
27.11
55.85
55.85
55.85
55.85
56.61
56.61
56.61
56.61
56.61
2
8th Feb ’99
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