MPC7410RX500PD View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
MPC7410RX500PD Datasheet PDF : 56 Pages
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System Design Information
Figure 29 describes the thermal performance of selected thermal interface materials.
Silicone Sheet (0.006")
2
Bare Joint
Floroether Oil Sheet (0.007")
Graphite/Oil Sheet (0.005")
Synthetic Grease
1.5
1
0.5
0
0
10
20
30
40
50
60
70
80
Contact Pressure (psi)
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be
selected based on high conductivity, yet adequate mechanical strength to meet equipment shock/vibration
requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
781-935-4850
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
800-248-2481
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
888-642-7674
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
45
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