M54HC73DT View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
M54HC73DT Datasheet PDF : 37 Pages
| |||
M54HCxxx, M54HCTxxx
5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 2. Ceramic Flat-14 package outline
)
*
'
+
$
+
1
/
(
0
%
&
(
1. The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package.
Connecting unused pins or the metallic lid to ground or to the power supply will not affect the electrical
characteristics.
Symbol
Table 7. Ceramic Flat-14 package mechanical data
Dimensions (mm)
Min.
Typ.
Max.
A
6.75
6.91
7.06
B
9.76
9.95
10.14
C
1.49
1.95
D
0.10
0.127
0.15
E
7.50
7.62
7.75
F
1.27
G
0.38
0.43
0.48
H
6.0
L
18.75
en
22.0
M
0.38
N
4.31
DocID17367 Rev 4
13/37
37
Share Link: 