NTD4809NA View Datasheet(PDF) - ON Semiconductor

Part Name

Description

MFG CO.

NTD4809NA

Power MOSFET

ON Semiconductor 

NTD4809NA

PACKAGE DIMENSIONS

DPAK

CASE 369D-01

ISSUE B

B

V

R

C

E

4

Z

A

S

123

-T-

SEATING

PLANE

K

F

G

J

H

D 3 PL

0.13 (0.005) M T

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

INCHES

DIM MIN MAX

A 0.235 0.245

B 0.250 0.265

C 0.086 0.094

D 0.027 0.035

E 0.018 0.023

F 0.037 0.045

G 0.090 BSC

H 0.034 0.040

J 0.018 0.023

K 0.350 0.380

R 0.180 0.215

S 0.025 0.040

V 0.035 0.050

Z 0.155 ---

MILLIMETERS

MIN MAX

5.97 6.35

6.35 6.73

2.19 2.38

0.69 0.88

0.46 0.58

0.94 1.14

2.29 BSC

0.87 1.01

0.46 0.58

8.89 9.65

4.45 5.45

0.63 1.01

0.89 1.27

3.93 ---

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

E

L2

E3

L1

T

SEATING

PLANE

b1

2X e

3.5 MM IPAK, STRAIGHT LEAD

CASE 369AD-01

ISSUE O

A

A1

E2

D2

D

L

A1

A2

3X b

0.13 M T

E2

D2

NOTES:

1.. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2.. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30mm FROM TERMINAL TIP.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD GATE OR MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 2.19 2.38

A1 0.46 0.60

A2 0.87 1.10

b 0.69 0.89

b1 0.77 1.10

D 5.97 6.22

D2 4.80 ---

E 6.35 6.73

E2 4.70 ---

E3 4.45 5.46

e

2.28 BSC

L 3.40 3.60

L1 --- 2.10

L2 0.89 1.27

OPTIONAL

CONSTRUCTION

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