MAX16975 View Datasheet(PDF) - Maxim Integrated
Part Name
Description
MFG CO.
MAX16975 Datasheet PDF : 17 Pages
| |||
MAX16975
28V, 1.2A Automotive Step-Down Converter
with Low Operating Current
Set the error-amplifier compensation zero formed by RC
and CC at the fpMOD (fzEA = fpMOD):
CC
=
2π
×
1
fpMOD
×
RC
If fzMOD is less than 5 O fC, add a second capacitor, CF,
from COMP to GND. Set fpEA = fzMOD and calculate CF
as follows:
CF
=
2π ×
1
fzMOD
×RC
PCB Layout Guidelines
Careful PCB layout is critical to achieve low switching
losses and clean, stable operation. Use a multilayer board
whenever possible for better noise immunity and power
dissipation. Follow these guidelines for good PCB layout:
1) Use a large contiguous copper plane under the
device package. Ensure that all heat-dissipating com-
ponents have adequate cooling.
2) Isolate the power components and high-current path
from the sensitive analog circuitry. This is essential to
prevent any noise coupling into the analog signals.
3) Keep the high-current paths short, especially at the
ground terminals. This practice is essential for stable,
jitter-free operation. Make the high-current path com-
prising of an input capacitor, high-side FET, inductor,
and the output capacitor as short as possible.
4) Keep the power traces and load connections short. This
practice is essential for high efficiency. Use thick copper
PCBs (2oz vs. 1oz) to enhance full-load efficiency.
5) Route the analog signal lines away from the high-
frequency planes. This ensures integrity of sensitive
signals feeding back into the device.
6) Make the ground connection for the analog and
power section close to the device. This keeps the
ground current loops to a minimum. In cases where
only one ground is used, enough isolation between
analog return signals and high power signals must be
maintained.
Ordering Information
PART
MAX16975AAEE/V+
MAX16975BAEE/V+
TEMP RANGE
-40°C to +125°C
-40°C to +125°C
PIN-PACKAGE
16 QSOP-EP*
16 QSOP
/V denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
16 QSOP
16 QSOP-EP
PACKAGE
CODE
E16+4
E16E+10
OUTLINE
NO.
21-0055
21-0112
LAND
PATTERN NO.
90-0167
90-0239
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