Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TA=25°C unless otherwise specified.
Symbol
Parameter
Maximum Drain-to-Source Voltage
VDS
(VDL-VCTR and VCTR-PG)
FSFR2100
All Others
LVCC
Low-side Supply Voltage
HVCC to VCTR High-side VCC Pin to Low-side Drain Voltage
HVCC
High-side Floating Supply Voltage
FSFR2100
All Others
VCON
VCS
VRT
dVCTR/dt
Control Pin Input Voltage
Current Sense (CS) Pin Input Voltage
RT Pin Input Voltage
Allowable Low-side MOSFET Drain Voltage Slew Rate
FSFR2100
PD
Total Power Dissipation(3)
FSFR2000
FSFR1900
FSFR1800
FSFR1700
Maximum Junction Temperature(4)
TJ
Recommended Operating Junction Temperature(4)
TSTG
Storage Temperature Range
MOSFET Section
VDGR
Drain Gate Voltage (RGS=1MΩ)
FSFR2100
All Others
VGS
Gate Source (GND) Voltage
FSFR2100
FSFR2000
IDM
Drain Current Pulsed
FSFR1900
FSFR1800
FSFR1700
FSFR2100 TC=25°C
TC=100°C
TC=25°C
FSFR2000
TC=100°C
ID
Continuous Drain Current
FSFR1900 TC=25°C
TC=100°C
FSFR1800 TC=25°C
TC=100°C
FSFR1700 TC=25°C
TC=100°C
Min.
600
500
-0.3
-0.3
-0.3
-0.3
-0.3
-5.0
-0.3
-40
-55
600
500
Max.
25.0
25.0
625.0
525.0
LVCC
1.0
5.0
50
12.0
12.0
11.8
11.7
11.6
+150
+130
+150
±30
33
31
26
23
20
11
7
9.5
6
8
5
7
4.5
6
3.9
Unit
V
V
V
V
V
V
V
V/ns
W
°C
°C
V
V
A
A
© 2007 Fairchild Semiconductor Corporation
FSFR series • 1.0.3
4
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