HCF4093 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

HCF4093

QUAD 2-input NAND Schmidt trigger

STMicroelectronics 

HCF4093

4

Package mechanical data

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 5. Plastic DIP-14 package outline

1. Drawing not to scale.

Table 8. Plastic DIP-14 mechanical data

Symbol

millimeters

Min

Typ

Max

a1

0.51

B

1.39

1.65

b

0.5

b1

0.25

D

20

E

8.5

e

2.54

e3

15.24

F

7.1

I

5.1

L

3.3

Z

1.27

2.54

P001A

Min

0.020

0.055

0.050

inches

Typ

0.020

0.010

0.335

0.100

0.600

0.130

Max

0.065

0.787

0.280

0.201

0.100

9/13

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