STTH1004FP View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
STTH1004FP Datasheet PDF : 7 Pages
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STTH1004
2
Package information
Package information
● Epoxy meets UL94, V0
● Cooling method: by conduction (C)
● Recommended torque calue: 0.8 Nm
● Maximum torque value: 1.0 Nm
Table 5. TO-220FPAC Dimensions
Dimensions
Ref.
Millimeters
Inches
L2
L3
L4
A
H
B
Dia
L6
L5
D
F1
F
E
G1
G
A
B
D
E
F
F1
L7
G
G1
H
L2
L3
L4
L5
L6
L7
Dia.
Min. Max.
4.4
4.6
2.5
2.7
2.5
2.75
0.45
0.70
0.75
1
1.15
1.70
4.95
5.20
2.4
2.7
10
10.4
16 Typ.
28.6
30.6
9.8
10.6
2.9
3.6
15.9
16.4
9.00
9.30
3.00
3.20
Min. Max.
0.173 0.181
0.098 0.106
0.098 0.108
0.018 0.027
0.030 0.039
0.045 0.067
0.195 0.205
0.094 0.106
0.393 0.409
0.63 Typ.
1.126 1.205
0.386 0.417
0.114 0.142
0.626 0.646
0.354 0.366
0.118 0.126
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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