NLAST44599DTR2G View Datasheet(PDF) - ON Semiconductor
Part Name
Description
MFG CO.
NLAST44599DTR2G Datasheet PDF : 12 Pages
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NLAST44599
PACKAGE DIMENSIONS
QFN−16
MN SUFFIX
CASE 485G−01
ISSUE B
D
A
ÎÎÎÎÎÎ PIN 1
ÎÎÎ LOCATION
B
E
0.15 C
0.15 C
TOP VIEW
0.10 C
16 X 0.08 C
(A3)
SIDE VIEW
A
SEATING
PLANE
A1
C
16X L
NOTE 5
16X K
D2
e
5
8
EXPOSED PAD
4
9
E2
1
12 e
0.575
0.022
3.25
0.128
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. Lmax CONDITION CAN NOT VIOLATE 0.2 MM
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K 0.20 −−−
L 0.30 0.50
SOLDERING FOOTPRINT*
3.25
0.128
0.30
0.012
EXPOSED PAD
1.50
0.059
16
13
16X b
0.10 C A B BOTTOM VIEW
0.05 C NOTE 3
0.30
0.50
0.012
ǒ Ǔ 0.02
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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