AD5737 View Datasheet(PDF) - Analog Devices

Part Name

Description

MFG CO.

AD5737

Quad-Channel, 12-Bit, Serial Input, 4 mA to 20 mA Output DAC with Dynamic Power Control and HART Connectivity

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to

100 mA do not cause SCR latch-up.

Table 4.

Parameter

AVDD, VBOOST_x to AGND, DGND

AVCC to AGND

DVDD to DGND

Digital Inputs to DGND

Digital Outputs to DGND

REFIN, REFOUT to AGND

IOUT_x to AGND

SWx to AGND

AGND, GNDSWx to DGND

Operating Temperature Range (TA)

Industrial1

Storage Temperature Range

Junction Temperature (TJ max)

Power Dissipation

Lead Temperature

Soldering

Rating

−0.3 V to +33 V

−0.3 V to +7 V

−0.3 V to +7 V

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

−0.3 V to AVDD + 0.3 V or +7 V

(whichever is less)

AGND to VBOOST_x or 33 V if

using the dc-to-dc converter

−0.3 V to +33 V

−0.3 V to +0.3 V

−40°C to +105°C

−65°C to +150°C

125°C

(TJ max − TA)/θJA

JEDEC industry standard

J-STD-020

1 Power dissipated on chip must be derated to keep the junction temperature

below 125°C.

AD5737

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Junction-to-air thermal resistance (θJA) is specified for a JEDEC

4-layer test board.

Table 5. Thermal Resistance

Package Type

θJA

64-Lead LFCSP (CP-64-3)

20

Unit

°C/W

ESD CAUTION

Rev. B | Page 9 of 44

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