AD5318BRU-REEL(RevB) View Datasheet(PDF) - Analog Devices

Part Name

Description

MFG CO.

AD5318BRU-REEL
(Rev.:RevB)

2.5 V to 5.5 V Octal Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP

Analog Devices 

AD5308/AD5318/AD5328

ABSOLUTE MAXIMUM RATINGS1, 2

(TA = 25°C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V

VOUTA–VOUTD to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (A, B Version) . . . . . . . . . . . . . –40°C to +105°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . . . . 150°C

16-Lead TSSOP

Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ MAX – TA)/␪JA

␪JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4°C/W

Reflow Soldering

Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C

Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability.

2Transient currents of up to 100 mA will not cause SCR latch-up.

Model

AD5308ARU

AD5308ARU-REEL7

AD5308BRU

AD5308BRU-REEL

AD5308BRU-REEL7

AD5318ARU

AD5318ARU-REEL7

AD5318BRU

AD5318BRU-REEL

AD5318BRU-REEL7

AD5318BRUZ*

AD5318BRUZ-REEL*

AD5318BRUZ-REEL7*

AD5328ARU

AD5328ARU-REEL7

AD5328BRU

AD5328BRU-REEL

AD5328BRU-REEL7

*Z = Pb-free part.

ORDERING GUIDE

Temperature Range

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

–40°C to +105°C

Package Description

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Package Option

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD5308/AD5318/AD5328 feature proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

–4–

REV. B

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