Si7013-A20
Table 7. Thermal Characteristics
Parameter
Symbol
Test Condition
DFN-6
Unit
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Air Thermal Resistance
Junction to Case Thermal Resistance
Junction to Board Thermal Resistance
JA
JA
JA
JC
JB
JEDEC 2-Layer board,
No Airflow
JEDEC 2-Layer board,
1 m/s Airflow
JEDEC 2-Layer board,
2.5 m/s Airflow
JEDEC 2-Layer board
JEDEC 2-Layer board
236
°C/W
s 203
°C/W
ign 191
°C/W
s 20
°C/W
De112
°C/W
Table 8. Absolute Maximum Ratings1,2
w Parameter
Symbol
Test Condition
Min Typ
Max
Unit
e Ambient temperature
under bias
–55 —
125
°C
N Storage Temperature
–65 —
150
°C
r Voltage on I/O pins
–0.3 — VDD+0.3 V V
fo Voltage on VDD with
respect to GND
d ESD Tolerance
HBM
–0.3 —
4.2
V
—
—
2
kV
eCDM
—
—
1.25
kV
d MM
—
—
250
V
n Notes:
1. Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may
e shorten the life of the device or alter its performance.
2. Special handling considerations apply; see application note, “AN607: Si70xx Humidity Sensor Designer’s Guide” for
Not Recomm details.
Rev. 1.4
11