74LV374DB View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
74LV374DB Datasheet PDF : 17 Pages
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74LV374
Octal D-type flip-flop; positive edge-trigger; 3-state
Rev. 02 — 14 May 2009
Product data sheet
1. General description
The 74LV374 is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop
and 3-state outputs for bus-oriented applications. A clock input (CP) and an output enable
input (OE) are common to all flip-flops. The 74LV374 is a low-voltage Si-gate CMOS
device and is pin and function compatible with 74HC374 and 74HCT374.
The eight flip-flops will store the state of their individual D-inputs that meet the set-up and
hold times requirements on the LOW to HIGH CP transition.
When OE is LOW, the contents of the eight flip-flops is available at the outputs. When OE
is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does
not affect the state of the flip-flops.
2. Features
I Wide operating voltage: 1.0 V to 5.5 V
I Optimized for low voltage applications: 1.0 V to 3.6 V
I Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
I Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
I Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and
Tamb = 25 °C
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
I Common 3-state output enable input
I Multiple package options
I Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range
74LV374N −40 °C to +125 °C
74LV374D −40 °C to +125 °C
74LV374DB −40 °C to +125 °C
74LV374PW −40 °C to +125 °C
Name Description
Version
DIP20 plastic dual in-line package; 20 leads (300 mil)
SOT146-1
SO20
plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
SSOP20 plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
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