NXP Semiconductors
74LV374
Octal D-type flip-flop; positive edge-trigger; 3-state
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
y
Z
20
c
11
E
A
X
HE
vM A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT163-1
IEC
075E04
REFERENCES
JEDEC
JEITA
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT163-1 (SO20)
74LV374_2
Product data sheet
Rev. 02 — 14 May 2009
© NXP B.V. 2009. All rights reserved.
12 of 17