Si7005
Table 6. Thermal Characteristics
Parameter
Junction-to-Air Thermal Resistance
Junction-to-Air Thermal Resistance
Symbol
JA
JA
Test Condition
JEDEC 4-layer board
2-layer evaluation PCB with
minimal thermal pad
QFN-24
55
110
Unit
°C/W
°C/W
Table 7. Absolute Maximum Ratings1,2
Parameter
Symbol Test Condition Min
Ambient Temperature under Bias
–55
Storage Temperature
–65
Voltage on SDA or SCL pin with
–0.3
respect to GND
Voltage on CS pin with respect to
–0.3
GND
Voltage on VDD with respect to GND
ESD Tolerance
–0.3
HBM
—
CDM
—
MM
—
Typ
Max
Unit
—
125
°C
—
150
°C
—
3.9
V
— VDD + 0.3 V
—
4.2
V
—
3
kV
—
750
V
—
300
V
Notes:
1. Absolute maximum ratings are stress ratings only; operation at or beyond these conditions is not implied and may
shorten the life of the device or alter its performance.
2. For best accuracy, after removal from the sealed shipping bags, the Si7005 should be stored in climate controlled
conditions (10 to 35 °C, 20 to 60 %RH). Exposure to high temperature and/or high humidity environments can cause a
small upwards shift in RH readings.
Rev. 1.3
9