Si7005
10. Package Outline
10.1. 24-Pin QFN
Figure 11 illustrates the package details for the Si7005. Tables 27 and 28 list the values for the dimensions shown
in the illustration. There are two package variants with slightly different height dimensions. The two package
variants are otherwise interchangeable.
Figure 11. 24-Pin Quad Flat No Lead (QFN)
Table 27. 24-Pin Package Diagram Dimensions
Dimension
Min
Nom
Max
Dimension
Min
Nom
Max
A1
0.00
0.02
0.05
H1
1.03
1.08
1.13
b
0.18
0.25
0.30
H2
1.68 REF
D
4.00 BSC.
L
0.30
0.35
0.40
D2
2.55
2.65
2.75
aaa
—
—
0.15
e
0.50 BSC.
bbb
—
—
0.15
E
4.00 BSC.
ccc
—
—
0.08
E2
2.55
2.65
2.75
ddd
—
—
0.10
Notes:
1. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
2. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Table 28. Package Variants
Variant A
Dimension
Min
Nom
Max
Min
A
0.80
0.90
1.00
0.70
Note: All Dimensions are in mm unless otherwise noted.
Variant B
Nom
0.75
Max
0.80
32
Rev. 1.3