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74HC283DB,118 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
MFG CO.
74HC283DB,118
NXP
NXP Semiconductors. 
74HC283DB,118 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Philips Semiconductors
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
74HC283
4-bit binary full adder with fast carry
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 12. Package outline SOT38-4 (DIP16)
9397 750 13811
Product data sheet
Rev. 03 — 11 November 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
14 of 20

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