W83877F View Datasheet(PDF) - Winbond
Part Name
Description
MFG CO.
W83877F Datasheet PDF : 125 Pages
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W83877F
12.0 PACKAGE DIMENSIONS
(100-pin QFP)
100
1
HD
D
81
80
E HE
30
31
51
e
b
50
See Detail F
Seating Plane
A2 A
A1
y
c
L
θ
L1
Detail F
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
Dimension in inches Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.130
3.30
0.004
0.10
0.107 0.112 0.117 2.73 2.85 2.97
0.010 0.012 0.016 0.25 0.30 0.40
0.004 0.006 0.010 0.10 0.15 0.25
0.546 0.551 0.556 13.87 14.00 14.13
0.782 0.787 0.792 19.87 20.00 20.13
0.020 0.026 0.032 0.50 0.65 0.80
0.728 0.740 0.752 18.49 18.80 19.10
0.964 0.976 0.988 24.49 24.80 25.10
0.039 0.047 0.055 1.00 1.20 1.40
0.087 0.094 0.103 2.21 2.40 2.62
0.004
0.10
θ
0
12
0
12
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27516023
FAX: 852-27552064
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Note: All data and specifications are subject to change without notice.
- 125 -
Publication Release Date: January 1996
Revision A2
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