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NCL30082B5 View Datasheet(PDF) - ON Semiconductor

Part Name
Description
MFG CO.
NCL30082B5 Datasheet PDF : 35 Pages
First Prev 31 32 33 34 35
NCL30082
PACKAGE DIMENSIONS
HE
PIN 1 ID e
SEATING
−T− PLANE
0.038 (0.0015)
Micro8t
CASE 846A−02
ISSUE J
D
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b 8 PL
0.08 (0.003) M T B S A S
A
MILLIMETERS
DIM MIN NOM MAX
A
−−
−−
1.10
A1 0.05
0.08
0.15
b
0.25
0.33
0.40
c
0.13
0.18
0.23
D 2.90
3.00
3.10
E
2.90
3.00
3.10
e
0.65 BSC
L
0.40
0.55
0.70
H E 4.75
4.90
5.05
MIN
−−
0.002
0.010
0.005
0.114
0.114
0.016
0.187
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.193
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
A1
c
L
RECOMMENDED
SOLDERING FOOTPRINT*
8X 0.48
8X
0.80
5.25
0.65
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
34

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