NGA10S15050SEC View Datasheet(PDF) - Murata Power Solutions
Part Name
Description
MFG CO.
NGA10S15050SEC Datasheet PDF : 5 Pages
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PACKAGE SPECIFICATIONS (continued)
MECHANICAL DIMENSIONS - DIP PACKAGE
0.874±0.020 (22.19±0.50)
0.846 (21.49)
6
5*
4
3 0.825 (20.96)
2
7
1*
0.222±0.020
(5.65±0.50 )
7
0.400
(10.16)
6
0.2
0.010±0.002
(0.25±0.05)
0.753 (19.14)
0.020±0.002 (0.50±0.05)
0.213 (5.41)
1*
2
3
4
5* 0.100 (2.54)
All dimensions in inches ±0.01 (mm ±0.25mm) except where stated otherwise.
All pins on a 0.1 (2.54) pitch and within 0.01 (0.25) of true position.
NGA Series
Non-Isolated Wide Input DC/DC Converters
RECOMMENDED FOOTPRINT
All dimensions in inches ±0.01 (mm ±0.25mm).
All pins on a 0.1 (2.54) pitch and within 0.01 (0.25) of true position.
PIN CONNECTIONS
Pin
Function
1*
SD
2
+VIN
3
COMMON
4
+VOUT
5*
VADJ
6
NC
7
NC
Weight: 4.0g
* Optional pins available on NGA10S15050DEC only
RoHS COMPLIANCE INFORMATION
This series is compatible with RoHS soldering systems with a peak wave solder temperature of 300ºC for 10 seconds. The pin
termination finish on the SIP package type is Tin Plate, Hot Dipped over Matte Tin with Nickel Preplate and Tin on the DIP types.
Both types in this series are backward compatible with Sn/Pb soldering systems.
For further information, please visit www.murata-ps.com/rohs
www.murata-ps.com
Technical enquiries - email: mk@murata-ps.com, tel: +44 (0)1908 615232
KDC_NGAC.E02 Page 4 of 5
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