MP62161DS View Datasheet(PDF) - Monolithic Power Systems
Part Name
Description
MFG CO.
MP62161DS
Monolithic Power Systems
MP62161DS Datasheet PDF : 13 Pages
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MP62160/MP62161 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH
ORDERING INFORMATION
Part Number Enable
MP62160DS
MP62160DD
MP62160DH*
MP62161DS
MP62161DD
MP62161DH
Active
Low
Active
High
Switch
Single
Maximum
Continuous
Load Current
2A
Typical Short-
Circuit Current
@ TA=25C
Package
SOIC8
QFN8E
(2mm x 3mm)
2.8A
MSOP8E
SOIC8
QFN8E
(2mm x 3mm)
MSOP8E
Top
Marking
62160DS
62160DD
62160DH
62161DS
62161DD
62161DH
Free Air
Temperature
(TA)
-40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP62160DH–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP62160DH–L)
TOP VIEW
PACKAGE REFERENCE
TOP VIEW
GND 1
IN 2
IN 3
EN* 4
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
8 OUT
7 OUT
6 OUT
5 FLAG
GND 1
IN 2
IN 3
EN* 4
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
8 OUT
7 OUT
6 OUT
5 FLAG
TOP VIEW
GND 1
IN 2
IN 3
EN* 4
8 OUT
7 OUT
6 OUT
5 FLAG
MSOP8E
QFN8E (2mm x 3mm)
MP62160/MP62161
Single-Channel
(*: EN is active high for MP62161)
SOIC8
ABSOLUTE MAXIMUM RATINGS (1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (TA = +25°C) (2)
MSOP8E .................................................... 2.3W
QFN8E (2mm x 3mm)................................ 2.3W
SOIC8 ........................................................ 1.4W
Junction Temperature ...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Operating Temperature.............. -40°C to +85°C
Thermal Resistance (3) θJA θJC
MSOP8E................................. 55 ...... 12... °C/W
QFN8E (2mm x 3mm) ............ 55 ...... 12... °C/W
SOIC8..................................... 90 ...... 42... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) Measured on JESD51-7, 4-layer PCB.
MP62160_MP62161 Rev. 0.9
www.MonolithicPower.com
2
7/8/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
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