GS8161E36D View Datasheet(PDF) - Giga Semiconductor
Part Name
Description
MFG CO.
GS8161E36D Datasheet PDF : 36 Pages
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GS8161E18(T/D)/GS816132(D)/GS816136(T/D)
TQFP Package Drawing (Package T)
Symbol Description Min. Nom. Max
θ
L
L1
c
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09 — 0.20
D Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
— 0.65 —
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
— 1.00 —
A1
Y
Coplanarity
0.10
A2
E1
θ
Lead Angle
0° — 7°
E
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 2.13 11/2004
31/36
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 1999, GSI Technology
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