SHF-0289 View Datasheet(PDF) - Unspecified
Part Name
Description
MFG CO.
SHF-0289 Datasheet PDF : 8 Pages
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Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
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SHF-0289 DC-3GHz, 1 Watt GaAs HFET
Part Number Ordering Information
Part Number
SHF-0289
Devices Per
Reel
1000
Reel Size
7"
Mounting and Thermal Considerations:
It is very important that adequate heat sinking be provided
to avoid exceeding the maximum device junction
temperature. All of the following suggestions should be
followed to ensure maximum operating life of the device:
1. Use 2 ounce copper if possible.
2. Use a large ground pad area with many plated through-
holes (solder filling is recommended).
3. Multiple filled vias are required directly below the SOT-
89 ground tab.
4. Solder the copper pad on the backside of the device
package to the ground plane.
5. Use three point board seating with 2-56 machine
screws (no more than 0.2 inch from the device) to provide
a low thermal resistance path to the plate. The thermal
resistance from ground lead to screws is 2 deg. C/W
6. We recommend thermal transfer paste be used
between the board and the mounting plate.
Part Symbolization
The part will be symbolized with a “H2” designator on
the top surface of the package.
Pin
Designation
1
Gate
2
Source
3
Drain
4
Source
Outline Drawing
1
2
4
3
522 Almanor Ave., Sunnyvale, CA 94086
Phone: (800) SMI-MMIC
7
http://www.stanfordmicro.com
EDS-101241 Rev A
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