MC33164 View Datasheet(PDF) - Microsemi Corporation
Part Name
Description
MFG CO.
MC33164 Datasheet PDF : 7 Pages
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PRODUCT DATABOOK 1996/1997
MC33164/MC34164
5V UNDERVOLTAGE SENSING CIRCUIT
PRODUCTION DATA SHEET
A B S O L U T E M A X I M U M R AT I N G S (Note 1)
Input Supply Voltage (V )............................................................................... -1V to 12V
IN
RESET Output Voltage (VOUT) .......................................................................... -1V to 12V
Clamp Diode Forward Current .............................................................................. 100mA
Operating Junction Temperature
Plastic (DM - Package) ......................................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
T H E R M A L D ATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
LP PACKAGE:
165°C/W
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
156°C/W
Junction Temperature Calculation: T = T + (P x θ ).
J
A
D
JA
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
PACKAGE PIN OUTS
RESET
INPUT
N.C.
GROUND
18
27
36
45
N.C.
N.C.
N.C.
N.C.
DM PACKAGE
(Top View)
3. GROUND
2. INPUT
1. RESET
LP PACKAGE
(Top View)
BLOCK DIAGRAM
INPUT
2(2)
RESET
1(1)
1.2 VREF
4(3)
GROUND
2
Copyright © 1997
Rev. 1.5 11/97
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