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LTC3603IUF(RevA) View Datasheet(PDF) - Linear Technology

Part Name
Description
MFG CO.
LTC3603IUF
(Rev.:RevA)
Linear
Linear Technology 
LTC3603IUF Datasheet PDF : 22 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
LTC3603
PACKAGE DESCRIPTION
UF Package
20-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1710 Rev A)
4.50 p 0.05
3.10 p 0.05
2.00 REF
2.45 p 0.05
2.45 p 0.05
0.70 p0.05
PACKAGE OUTLINE
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 p 0.10
0.75 p 0.05
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
4.00 p 0.10
2.00 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
19 20
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 s 45o
CHAMFER
0.40 p 0.10
1
2.45 p 0.10
2
2.45 p 0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UF20) QFN 01-07 REV A
0.25 p 0.05
0.50 BSC
3603fa
20

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