MC10H643 MC100H643
ECL INPUT
D
D
VBB
LEN
EN
LOGIC DIAGRAM
Q0
Q1
Q2
D
Q
Q3
TTL OUTPUTS
Q4
Q5
Q6
Q7
DC CHARACTERISTICS (IVT = OVT = 5.0V ±5%; VEE = –5.2V ±5% (10H Version); VEE = –4.5V ±0.3V (100H Version))
0°C
25°C
85°C
Symbol
Characteristic
Min Max Min Max Min Max Unit
Condition
IEE
ECL
–
42
–
42
–
42
mA
VEE Pins
ICCL
Power Supply Current TTL
–
106
–
106
–
106
mA Total all OVT
ICCH
–
95
–
95
–
95
mA and IVT pins
AC CHARACTERISTICS (IVT = OVT = 5.0V ±5%; VEE = –5.2V ±10% (10H); –4.5V ±0.3V (100H); VCCE = GND)
0°C
25°C
85°C
Symbol
Characteristic
Min Max Min Max Min Max Unit
Condition
tPLH
Propagation Delay to Output
D
LEN
EN
4.0
5.0
4.1
5.1
4.4
5.4
3.5
5.5
3.5
5.5
3.9
5.9
3.5
5.5
3.5
5.5
3.9
5.9
ns
CL = 50pF
tSKEW
tw
ts
Within–Device Skew
Pulse Width Out
HIGH or LOW
@ fout = 50MHz
Setup Time
D
–
0.5
–
0.5
0.5
ns
Note 1
CL = 50pF
9.0
11.0
9.0
11.0
9.0
11.0
ns
Note 2
0.75
–
0.75
–
0.75
–
ns
th
Hold Time
D
0.75
–
0.75
–
0.75
–
ns
tRR
Recovery Time
LEN
EN
1.25
–
1.25
–
1.25
–
ns
1.25
–
1.25
–
1.25
–
tpw
Minimum Pulse Width
LEN
EN
1.5
–
1.5
–
1.5
–
ns
1.5
–
1.5
–
1.5
–
tr
Rise / Fall Times
tf
0.8 V – 2.0 V
–
1.2
–
1.2
–
1.2
ns
CL = 50pF
1. Within–Device skew defined as identical transitions on similar paths through a device.
2. Pulse width is defined relative to 1.5V measurement points on the ouput waveform.
MOTOROLA
2–2
MECL Data
DL122 — Rev 6