LBM673 View Datasheet(PDF) - Unspecified

Part Name

Description

MFG CO.

LBM673

Hyper Mini TOPLED Hyper-Bright LED

Unspecified 

Empfohlenes Lötpaddesign8)Seite 16

Recommended Solder Pad8)page 16

Reflow Löten

Reflow Soldering

2.8 (0.110)

0.8 (0.031)

LB M673, LT M673

Padgeometrie

für verbesserte

Wärmeableitung

Paddesign

for improved

heat dissipation

Cu-Fläche > 16 mm 2

Cu-area > 16 mm 2

Lötstopplack

Solder resist

2.8 (0.110)

0.8 (0.031)

OHLPY978

2012-06-15

11

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