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Vishay BCcomponents
Table 10
TEST PROCEDURES AND REQUIREMENTS
NAME OF TEST
TEST
REFERENCE
PROCEDURE
(quick reference)
REQUIREMENTS
Mounting
IEC 60 384-18,
subclause 4.3
Shall be performed prior to tests mentioned below;
reflow soldering;
for maximum temperature load
refer to chapter “Mounting”
C/C: ± 5 %
tan spec. limit
IL2 spec. limit
Endurance
IEC 60384-18 / CECC32300, Tamb = 105 °C; UR applied;
subclause 4.15
for test duration see Table 8
UR = 6.3 V; C/C: ± 25 %
UR 10 V; C/C: ± 20 %
tan 2 x spec. limit
IL2 spec. limit
C/C: ± 30 %
Useful life
CECC 30301,
subclause 1.8.1
Tamb = 105 °C; UR and IR applied;
for test duration see Table 8
tan 3 x spec. limit
IL2 spec. limit
no short or open circuit
total failure percentage: 1 %
Shelf life
(storage at high
temperature)
IEC 60 384-18 /
CECC32 300,
subclause 4.17
Tamb = 105 °C; no voltage applied;
1000 h
after test: UR to be applied for 30 min,
24 h to 48 h before measurement
For requirements
see “Endurance test” above
Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the
lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability.
Revision: 12-Dec-16
13
Document Number: 28395
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