B57871S0103H View Datasheet(PDF) - Unspecified

Part Name

Description

MFG CO.

B57871S0103H

Temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm

Unspecified 

Temperature measurement

Leaded NTC thermistors, lead spacing 2.5 mm

Solder joint profiles for silver/nickel/tin terminations

B57871S

S871

1.3.3 Recommended geometry of solder pads

Recommended maximum dimensions (mm)

Case size A

B

C

inch/mm

0402/1005 0.6

0.6

1.7

0603/1608 1.0

1.0

3.0

0805/2012 1.3

1.2

3.4

1206/3216 1.8

1.2

4.5

1.3.4 Notes

Iron soldering should be avoided, hot air methods are recommended for repair purposes.

Please read Cautions and warnings and

Important notes at the end of this document.

Page 19 of 27

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