VO14642AABTR View Datasheet(PDF) - Vishay Semiconductors

Part Name

Description

MFG CO.

VO14642AABTR

1 Form A Solid-State Relay

Vishay Semiconductors 

www.vishay.com

VO14642AT, VO14642AABTR

Vishay Semiconductors

ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)

PARAMETER

TEST CONDITION

SYMBOL

VALUE

UNIT

INPUT

LED continous forward current

IF

50

mA

LED reverse voltage

VR

5

V

LED power dissipation

OUTPUT

At 25 °C

Pdiss

80

mW

DC or peak AC load voltage

VL

60

V

Load current (DC only)

IL

2

A

Peak load current (AC/DC)

t = 10 ms

ILPK

3.6

A

Output power dissipation

At 25 °C

Pdiss

250

mW

SSR

Total power dissipation

Pdiss

330

mW

Ambient temperature range

Tamb

-55 to +85

°C

Storage temperature range

Soldering temperature (1)

Tstg

-55 to +125

°C

t ≤ 10 s max.

Tsld

260

°C

Notes

• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not

implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute

maximum ratings for extended periods of the time can adversely affect reliability

(1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through

hole devices (DIP)

ABSOLUTE MAXIMUM RATING CURVE

2.5

DC mode

2.0

1.5

AC/DC mode

1.0

0.5

0.0

-50 -25 0 25 50 75 100

Ambient Temperature/°C

Fig. 1 - Load Current (AC/DC) vs. Temperature

THERMAL CHARACTERISTICS

PARAMETER

TEST CONDITION

SYMBOL VALUE

UNIT

Maximum LED junction temperature

Maximum output die junction temperature

Thermal resistance, junction emitter to board

Thermal resistance, junction emitter to case

Thermal resistance, junction detector to board

Thermal resistance, junction detector to case

Thermal resistance, junction emitter to junction detector

Thermal resistance, case to ambient

At 25 °C

At 25 °C

At 25 °C

At 25 °C

At 25 °C

At 25 °C

At 25 °C

At 25 °C

Tjmax.

Tjmax.

θEB

θEC

θDB

θDC

θED

θCA

125

125

176

208

67

134

310

2180

°C

°C

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Note

• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the

temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of

PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's thermal

characteristics of optocouplers application note

Rev. 1.6, 12-Jun-17

2

Document Number: 81646

For technical questions, contact: optocoupleranswers@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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