TSH63CDT View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
TSH63CDT Datasheet PDF : 13 Pages
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Package Mechanical Data
6
Package Mechanical Data
TSH60,61,62,63,64
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6.1
SO-8 package
SO-8 MECHANICAL DATA
DIM.
A
A1
A2
B
C
D
E
e
H
h
L
k
ddd
MIN.
1.35
0.10
1.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
mm.
TYP
1.27
MAX.
1.75
0.25
1.65
0.51
0.25
5.00
4.00
MIN.
0.053
0.04
0.043
0.013
0.007
0.189
0.150
6.20
0.228
0.50
0.010
1.27
0.016
8˚ (max.)
0.1
inch
TYP.
0.050
MAX.
0.069
0.010
0.065
0.020
0.010
0.197
0.157
0.244
0.020
0.050
0.04
10/13
0016023/C
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