datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

S-1172B25-U5T1G View Datasheet(PDF) - Seiko Instruments Inc

Part Name
Description
MFG CO.
S-1172B25-U5T1G Datasheet PDF : 34 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Rev.1.1_00
HIGH RIPPLE-REJECTION LOW DROPOUT HIGH OUTPUT CURRENT CMOS VOLTAGE REGULATOR
S-1172 Series
Power Dissipation of HSOP-6 (Reference)
Power dissipation of package differs depending on the mounting conditions.
Consider the power dissipation characteristics under the following conditions as reference.
[Mounted board]
(1) Board size :
(2) Board material :
(3) Wiring ratio :
(4) Test conditions :
(5) Land pattern :
50 mm × 50 mm × t1.6 mm
Glass epoxy resin (two layers)
90%
When mounted on board (wind speed : 0 m/s)
Refer to the recommended land pattern (drawing code : FH006-A)
2400
2000
1600
1200
800
400
0
0
50
100
150
Ambient temperature (Ta) [°C]
Figure 5 Power Dissipation of Package (When Mounted on Board)
Condition
HSOP-6 (When mounted on board)
Table 6
Power Dissipation (Reference)
2000 mW
Thermal Resistance Value (θja)
50°C/W
Seiko Instruments Inc.
7

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]