PAD CONFIGURATION
Chip size: X=2.50mm, Y=10.14mm
Chip thickness: 280μm
PAD size
- Driver output: X=90μm, Y=60μm
(SEGA1 to 35, SEGB1 to 35, ADA, ADB,
COM1 to 20)
- Logic input/output: X=90μm, Y=65μm
(DA, CS, CP, RESET, OSC0, DO, TEST)
- Power: X=90μm, Y=80μm
(VDD, L-GND, VDISP, D-GND)
Alignment Mark;
PT6301
V1.2
27
March 2012