MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS22054
TRANSFER-MOLD TYPE
INSULATED TYPE
MECHANICAL CHARACTERISTICS AND RATINGS
Parameter
Mounting torque
Weight
Heat-sink flatness
Condition
Limits
Unit
Min.
Typ.
Max.
Mounting screw : M4
Recommended 1.18 N·m 0.98
—
1.47 N·m
—
77
—
g
(Note 6) –50
—
100
µm
Note 6: Measurement point of heat-sink flatness
+–
Heat-sink side
Measurement location
3.25mm
–
+
Heat-sink side
RECOMMENDED OPERATION CONDITIONS
Symbol
Parameter
Condition
Limits
Min.
Typ.
VCC
Supply voltage
VD
Control supply voltage
VDB
Control supply voltage
∆VD, ∆VDB Control supply variation
tdead
Arm shoot-through blocking time
fPWM
PWM input frequency
IO
Output r.m.s. current
PWIN(on)
Applied between P-NU, NV, NW
Applied between VP1-VPC, VN1-VNC
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
For each input signal, TC ≤ 100°C
TC ≤ 100°C, Tj ≤ 125°C
VCC = 600V, VD = 15V, fC = 15kHz
P.F = 0.8, sinusoidal
Tj ≤ 125°C, TC ≤ 100°C
(Note 7)
(Note 8)
350
13.5
13.5
–1
3.3
—
—
1.5
600
15.0
15.0
—
—
—
—
—
350 ≤ VCC ≤ 800V,
13.5 ≤ VD ≤ 16.5V,
Ic ≤ 15A
2.5
—
Minimum input pulse width
PWIN(off)
13.5 ≤ VDB ≤ 16.5V,
–20°C ≤ TC ≤ 100°C,
N line wiring inductance less than
15 < Ic ≤ 25.5A
2.7
—
10nH
(Note 9)
VNC
VNC variation
Between VNC-NU, NV, NW (including surge)
–5.0
—
Note 7 : The output r.m.s. current value depends on the actual application conditions.
8 : DIP-IPM might not make response to the input on signal with pulse width less than PWIN (on).
9 : DIP-IPM might not make response or work properly if the input off signal pulse width is less than PWIN (off).
Max.
800
16.5
16.5
1
—
15
5.5
—
—
—
5.0
Unit
V
V
V
V/µs
µs
kHz
Arms
µs
V
May 2005