PCF2105MU View Datasheet(PDF) - Philips Electronics
Part Name
Description
MFG CO.
PCF2105MU Datasheet PDF : 48 Pages
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Philips Semiconductors
LCD controller/driver
Table 12 Bonding pad locations (dimensions in µm).
All x/y coordinates are referenced to centre of chip,
see Fig.30.
SYMBOL
OSC
VDD
SA0
VSS
R8
R7
R6
R5
R32
R31
R30
R29
R24
R23
R22
R21
R20
R19
R18
R17
C60
C59
C58
C57
C56
C55
C54
C53
C52
C51
C50
C49
C48
C47
C46
C45
C44
C43
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
x
−2 184.5
−2 024.5
−1 864.5
−1 704.5
−1 339
−1 179
−1 019
−859
−699
−539
−379
−219
−59
101
261
421
581
741
901
1 061
1 221
1 381
1 541
1 701
1 861
2 021
2 181
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
y
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 637
−2 445
−2 285
−2 125
−1 965
−1 805
−1 645
−1 485
−1 325
−1 165
−1 005
−845
SYMBOL
C42
C41
C40
C39
C38
C37
C36
C35
C34
C33
C32
C31
C30
C29
C28
C27
C26
C25
C24
C23
C22
C21
C20
C19
C18
C17
C16
C15
C14
C13
C12
C11
C10
C9
C8
C7
C6
C5
1998 Jul 30
45
PAD
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
Product specification
PCF2105
x
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 350
2 185
2 025
1 865
1 705
1 545
1 385
1 225
1 065
905
745
585
425
265
105
−55
−215
−375
−535
y
−685
−525
−365
−205
−45
115
275
435
595
755
915
1 075
1 235
1 395
1 555
1 715
1 875
2 035
2 195
2 355
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
2 637.5
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