PCF2105MU View Datasheet(PDF) - Philips Electronics

Part Name

Description

MFG CO.

PCF2105MU

LCD controller/driver

Philips Electronics 

Philips Semiconductors

LCD controller/driver

18 BONDING PAD LOCATIONS

Product specification

PCF2105

handbook, full pagewidth

86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59

R15 87

R16 88

R25 89

R26 90

R27 91

R28 92

R1 93

R2 94

R3 95

R4 96

≈ 5.63

mm

SCL 97

E 98

RS 99

R/W 100

T1 101

DB7 102

DB6 103

DB5 104

DB4 105

DB3 106

DB2 107

DB1 108

DB0 109

SDA 110

VLCD 111

1234

x

0

0

y

PCF2105

58 C23

57 C24

56 C25

55 C26

54 C27

53 C28

52 C29

51 C30

50 C31

49 C32

48 C33

47 C34

46 C35

45 C36

44 C37

43 C38

42 C39

41 C40

40 C41

39 C42

38 C43

37 C44

36 C45

35 C46

34 C47

33 C48

32 C49

31 C50

30 C51

29 C52

28 C53

5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

≈ 5.10 mm

MGK857

Chip dimensions: approximately 5.10 × 5.63 mm.

Gold bump dimensions: approximately 89 × 89 × 25 µm.

Fig.30 Bonding pad locations.

1998 Jul 30

44

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