NXP Semiconductors
PCA9521
Fast dual bidirectional bus buffer
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
1
e
4
bp
wM
A2 A1
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT505-1
v
w
y
Z(1)
θ
0.1
0.1
0.1
0.70
0.35
6°
0°
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
Fig 18. Package outline SOT505-1 (TSSOP8)
PCA9521
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 19 March 2013
© NXP B.V. 2013. All rights reserved.
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