PALCE16V8 View Datasheet(PDF) - Lattice Semiconductor
Part Name
Description
MFG CO.
PALCE16V8 Datasheet PDF : 32 Pages
| |||
4V
VCC
Power
tPR
Registered
Output
tS
Clock
tWL
FOR Figure 3. Power-Up Reset Waveform
16493E-12
TYPICAL THERMAL CHARACTERISTICS
S Measured at 25°C ambient. These parameters are not tested.
E S Parameter
IC N Symbol
Parameter Description
Typ
PDID
PLCC
Unit
EV IG θjc
Thermal impedance, junction to case
D S θja
Thermal impedance, junction to ambient
25
71
200 lfpm air
61
22
°C/W
64
°C/W
55
°C/W
E400 lfpm air
55
L D θjma
Thermal impedance, junction to ambient with air flow
600 lfpm air
51
51
°C/W
47
°C/W
A 800 lfpm air
47
45
°C/W
E G EW Plastic θjc Considerations
S N The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the pack-
U age surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package.
Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant tem-
perature. Therefore, the measurements can only be used in a similar environment.
30
PALCE16V8 and PALCE16V8Z Families
Share Link: 